Proceedings Volume 10144 is from: Logo
Feb 26 - Mar 2 2017
San Jose, California, United States
Front Matter: Volume 10144
Proc. SPIE 10144, Front Matter: Volume 10144, 1014401(26 April 2017);doi: 10.1117/12.2279246
Nanoprint Lithography for High-Volume Manufacturing
Proc. SPIE 10144, Nanoimprint system development for high-volume semiconductor manufacturing the and status of overlay performance, 1014405(21 March 2017);doi: 10.1117/12.2258385
Proc. SPIE 10144, Study of nanoimprint lithography (NIL) for HVM of memory devices, 1014406(21 March 2017);doi: 10.1117/12.2257951
Proc. SPIE 10144, Improved defectivity and particle control for nanoimprint lithography high-volume semiconductor manufacturing, 1014407(21 March 2017);doi: 10.1117/12.2257647
Proc. SPIE 10144, High throughput nanoimprint lithography for semiconductor memory applications, 1014408(21 March 2017);doi: 10.1117/12.2260466
Proc. SPIE 10144, Overlay control for nanoimprint lithography, 1014409(3 April 2017);doi: 10.1117/12.2256715
Nanoprint Masks and Applications
Proc. SPIE 10144, Selective surface smoothening of 3D micro-optical elements, 101440B(21 March 2017);doi: 10.1117/12.2256358
Proc. SPIE 10144, New 3D structuring process for non-integrated circuit related technologies (Conference Presentation), 101440C();doi: 10.1117/12.2258603
Proc. SPIE 10144, Development of nanoimprint lithography templates for the contact hole layer application (Conference Presentation), 101440D();doi: 10.1117/12.2263460
DSA Integration
Proc. SPIE 10144, Overview and development of EDA tools for integration of DSA into patterning solutions, 101440E(21 March 2017);doi: 10.1117/12.2264178
Proc. SPIE 10144, Free energy modeling of block-copolymer within pillar confinements on DSA lithography, 101440F(21 March 2017);doi: 10.1117/12.2257638
Proc. SPIE 10144, Process, design rule, and layout co-optimization for DSA based patterning of sub-10nm Finfet devices, 101440G(21 March 2017);doi: 10.1117/12.2257313
Proc. SPIE 10144, Advanced fast 3D DSA model development and calibration for design technology co-optimization, 101440H(27 April 2017);doi: 10.1117/12.2260379
Direct-Write, Maskless Lithography
Proc. SPIE 10144, Progress on complementary patterning using plasmon-excited electron beamlets (Conference Presentation), 101440K();doi: 10.1117/12.2258163
Proc. SPIE 10144, Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system, 101440L(21 March 2017);doi: 10.1117/12.2257967
Proc. SPIE 10144, Overlay performance assessment of MAPPER's FLX-1200 (Conference Presentation), 101440N();doi: 10.1117/12.2260878
DSA Process and Integration: Joint Session with Conferences 10146 and 10144
Proc. SPIE 10144, Advanced surface affinity control for DSA contact hole shrink applications, 101440O(21 March 2017);doi: 10.1117/12.2258043
Proc. SPIE 10144, Pattern defect reduction and LER improvement of chemo-epitaxy DSA process, 101440Q(21 March 2017);doi: 10.1117/12.2257952
DSA Materials and Processes: Joint Session with Conferences 10146 and 10144
Proc. SPIE 10144, Wide-range directed self-assembly lithography enabling wider range of applicable pattern size for both hexagonal multi-hole and line/space, 101440R(28 March 2017);doi: 10.1117/12.2257987
Poster Session
Proc. SPIE 10144, Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow, 101440V(21 March 2017);doi: 10.1117/12.2260002
Proc. SPIE 10144, RLT uniformity improvement utilizing multi-scale NIL process simulation, 101440X(31 March 2017);doi: 10.1117/12.2258172
Proc. SPIE 10144, Latest evolution in a 300mm graphoepitaxy pilot line flow for L/S applications, 1014411(21 March 2017);doi: 10.1117/12.2257969
Proc. SPIE 10144, The opportunity and challenge of spin coat based nanoimprint lithography, 1014412(21 March 2017);doi: 10.1117/12.2257845
Proc. SPIE 10144, Inspection and fabrication of nano-imprint stamp using electron and ion dual beam system, 1014413(21 March 2017);doi: 10.1117/12.2257398
Proc. SPIE 10144, Model-based guiding pattern synthesis for on-target and robust assembly of via and contact layers using DSA, 1014414(21 March 2017);doi: 10.1117/12.2257314
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