26 April 2017 Front Matter: Volume 10144
This PDF file contains the front matter associated with SPIE Proceedings Volume 10144, including the Title Page, Copyright information, Table of Contents, Introduction (if any), and Conference Committee listing.

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Author(s), “Title of Paper,” in Emerging Patterning Technologies, edited by Christopher Bencher, Proceedings of SPIE Vol. 10144 (SPIE, Bellingham, WA, 2017) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510607392

ISBN: 9781510607408 (electronic)

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  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.


Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Aghili, Ali, 07

Ait-Ferhat, Dehia, 0E

Altana, Mirco, 0B

Argoud, Maxime, 0O, 11

Asakawa, Koji, 0R

Asano, Masafumi, 06

Azuma, Hisanobu, 07

Bok, Cheolkyu, 12

Bos, Sandra, 0O

Brianceau, P., 0V

Cayrefourcq, Ian, 0O

Chamiot-Maitral, G., 11

Chevalier, Xavier, 0O, 11

Chidambaram, Nachiappan, 0B

Cho, Changhyun, 0F

Cho, Jungbin, 12

Choi, Eun Hyuk, 06, 12

Choi, Jin, 05, 07

Chouiki, M., 0V

Claveau, G., 11

Delachat, Florian, 0O

Eibelhuber, M., 0V

Esashi, Masayoshi, 0L

Fenger, Germain, 0E

Fletcher, Brian, 08

Fukuhara, Kazuya, 06, 09

Gharbi, Ahmed, 0O

Granik, Yuri, 0E

Hatano, Masayuki, 06

Hayashi, Tatsuya, 05

Hazart, Jérôme, 0O

Hiura, Mitsuru, 05

Hong, Hyeongsun, 0F

Ido, Yasuyuki, 0Q

Ikegami, Naokatsu, 0L

Im, Ji-Young, 0X

Inanami, Ryoichi, 0X

Irving, J. W., 08

Ito, Kiyohito, 0Q

Jones, Chris E., 07

Jung, ES, 0F

Jung, Wooyung, 06, 09, 12

Kapral, Chris, 0E

Khaira, Daman, 0E

Khusnatdinov, Niyaz, 08

Kim, Hyun-Woo, 0F

Kimura, Atsushi, 05

Kirchner, Robert, 0B

Kitano, Takahiro, 0Q

Kobayashi, Kei, 06, 12

Kobayashi, Sachiko, 0X

Kodachi, Nobuhiro, 05

Kojima, Akira, 0L

Komori, Motofumi, 0X

Kono, Takuya, 06, 09, 0X, 12

Koshida, Nobuyoshi, 0L

Krasnova, Polina, 0E

Landis, S., 0V

Lapeyre, Céline, 0O

Laure, M., 0V

Lee, Kyupil, 0F

Lim, Yonghyun, 09, 12

Liu, Weijun, 08

Longsine, Whitney, 08

Ma, Yuansheng, 0E, 14

Maeda, Shimon, 0X

Matsuoka, Yoichi, 07

Mayr, M., 0V

Mishima, Kazuhiko, 05

Mitra, Joydeep, 0E, 0G, 14

Mitsuyasu, Masaki, 09

Miyaguchi, Hiroshi, 0L

Mizuno, Makoto, 07

Monget, Cédric, 0O

Morikita, Shinya, 0Q

Morita, Seiji, 0R

Morohoshi, Hiroshi, 05

Muramatsu, Makoto, 0Q

Muroyama, Masanori, 0L

Nakasugi, Tetsuro, 06, 09, 12

Nakayama, Takahiro, 07

Navarro, Christophe, 0O, 11

Nicolet, Célia, 0O

Nishi, Takanori, 0Q

Oikawa, Noriaki, 0Q

Pain, Laurent, 0O, 0V

Pan, David Z., 0G, 14

Park, Jemin, 0F

Park, Joonsoo, 0F

Park, Seokhan, 0F

Pimenta Barros, Patricia, 0O, 11

Saito, Ryuichi, 0R

Saito, Yusuke, 0Q

Sasao, Norikatsu, 0R

Sawabe, Tomoaki, 0R

Schift, Helmut, 0B

Shy, Shyi-Long, 13

Stachowiak, Tim, 08

Suda, Ryutaro, 0L

Sugimura, Shinobu, 0R

Suzaki, Yoshio, 05

Suzuki, Masato, 06, 09

Takabayashi, Yukio, 05, 07

Teyssedre, H., 0V

Thanner, C., 0V

Ting, Yung-Chiang, 13

Tiron, Raluca, 0O, 11

Tobana, Toshikatsu, 0Q

Tokue, Hiroshi, 06

Torres, J. Andres, 0E, 0G, 14

Totsu, Kentaro, 0L

Traub, Matthew, 08

Tsuda, Hirotaka, 0X

Tsuji, Masatoshi, 12

Washida, Kazuhiro, 0X

Wimplinger, M., 0V

Yamamoto, Ryosuke, 0R

Yamashita, Kyoji, 0X

Ye, Zhengmao, 08

Yonekawa, Masami, 07

Yoshida, Shinya, 0L

Yoshida, Takahiro, 05

Yoshida, Takashi, 0L

You, Gen, 0Q

Zhang, Wei, 08

Zorbach, W., 0V

Conference Committee

Symposium Chair

  • Bruce W. Smith, Rochester Institute of Technology (United States)

Symposium Co-Chair

  • Will Conley, Cymer, An ASML Company (United States)

Conference Chair

  • Christopher Bencher, Applied Materials, Inc. (United States)

Conference Co-Chair

  • Joy Y. Cheng, Taiwan Semiconductor Manufacturing Company (Taiwan)

Conference Program Committee

  • Alan D. Brodie, KLA-Tencor Corporation (United States)

    Kenneth R. Carter, University of Massachusetts Amherst (United States)

    Damon M. Cole, Intel Corporation (United States)

    Juan J. de Pablo, The University of Chicago (United States)

    Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States)

    Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

    Daniel J. C. Herr, The University of North Carolina at Greensboro (United States)

    Tatsuhiko Higashiki, Toshiba Corporation (Japan)

    James A. Liddle, National Institute of Standards and Technology (United States)

    Shy-Jay Lin, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

    Chi-Chun Liu, IBM Corporation (United States)

    Hans Loeschner, IMS Nanofabrication AG (Austria)

    John G. Maltabes, Hewlett-Packard Laboratories (United States)

    Dan B. Millward, Micron Technology, Inc. (United States)

    Laurent Pain, CEA-LETI (France)

    Moshe E. Preil, KLA-Tencor Corporation (United States)

    Ivo W. Rangelow, Technische Universität Ilmenau (Germany)

    Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States)

    Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)

    Ricardo Ruiz, HGST (United States)

    Frank M. Schellenberg, Consultant (United States)

    Helmut Schift, Paul Scherrer Institut (Switzerland)

    Ines A. Stolberg, Vistec Electron Beam Lithography Group (Germany)

    Hsinyu Tsai, IBM Thomas J. Watson Research Center (United States)

    Kevin T. Turner, University of Pennsylvania (United States)

    Marco J. Wieland, MAPPER Lithography (Netherlands)

    Wei Wu, The University of Southern California (United States)

Session Chairs

  • 1 Keynote Session

    Christopher Bencher, Applied Materials, Inc. (United States)

    Hans Loescher, IMS Nanofabrications AG (Austria)

  • 2 Nanoprint Lithography for High-Volume Manufacturing

    Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)

    John G. Maltabes, Jordan Valley Semiconductors, Inc. (United States)

  • 3 Nanoprint Masks and Applications

    Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

    Helmut Schift, Paul Scherrer Institut (Switzerland)

  • 4 DSA Integration

    James A. Liddle, National Institute of Standards and Technology (United States)

    Hsinyu Tsai, IBM Thomas J. Watson Research Center (United States)

  • 5 Direct-Write, Maskless Lithography

    Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

    Marco Wieland, MAPPER Lithography (Netherlands)

  • 6 6 DSA Process and Integration: Joint Session with Conferences 10146 and 10144

    Ralph R. Dammel, EMD Performance Materials Corporation (United States)

    Chi-Chun Liu, IBM Corporation (United States)

  • 7 DSA Materials and Processes: Joint Session with Conferences 10146 and 10144

    Daniel P. Sanders, IBM Research - Almaden (United States)

    Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States)

© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 10144", Proc. SPIE 10144, Emerging Patterning Technologies, 1014401 (26 April 2017); doi: 10.1117/12.2279246; https://doi.org/10.1117/12.2279246

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