28 March 2017 High-volume manufacturing device overlay process control
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Overlay control based on DI metrology of optical targets has been the primary basis for run-to-run process control for many years. In previous work we described a scenario where optical overlay metrology is performed on metrology targets on a high frequency basis including every lot (or most lots) at DI. SEM based FI metrology is performed ondevice in-die as-etched on an infrequent basis. Hybrid control schemes of this type have been in use for many process nodes. What is new is the relative size of the NZO as compared to the overlay spec, and the need to find more comprehensive solutions to characterize and control the size and variability of NZO at the 1x nm node: sampling, modeling, temporal frequency and control aspects, as well as trade-offs between SEM throughput and accuracy.
Conference Presentation
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Honggoo Lee, Honggoo Lee, Sangjun Han, Sangjun Han, Jaeson Woo, Jaeson Woo, DongYoung Lee, DongYoung Lee, ChangRock Song, ChangRock Song, Hoyoung Heo, Hoyoung Heo, Irina Brinster, Irina Brinster, DongSub Choi, DongSub Choi, John C. Robinson, John C. Robinson, } "High-volume manufacturing device overlay process control", Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450D (28 March 2017); doi: 10.1117/12.2257836; https://doi.org/10.1117/12.2257836

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