28 March 2017 Patterned wafer geometry grouping for improved overlay control
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Abstract
Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress. Previous studies have shown the correlation between process-induced stress and overlay and the opportunity for improvement in process control, including the use of patterned wafer geometry (PWG) metrology to reduce stress-induced overlay signatures. Key challenges of volume semiconductor manufacturing are how to improve not only the magnitude of these signatures, but also the wafer to wafer variability. This work involves a novel technique of using PWG metrology to provide improved litho-control by wafer-level grouping based on incoming process induced overlay, relevant for both 3D NAND and DRAM. Examples shown in this study are from 19 nm DRAM manufacturing.
Conference Presentation
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Honggoo Lee, Honggoo Lee, Sangjun Han, Sangjun Han, Jaeson Woo, Jaeson Woo, Junbeom Park, Junbeom Park, Changrock Song, Changrock Song, Fatima Anis, Fatima Anis, Pradeep Vukkadala, Pradeep Vukkadala, Sanghuck Jeon, Sanghuck Jeon, DongSub Choi, DongSub Choi, Kevin Huang, Kevin Huang, Hoyoung Heo, Hoyoung Heo, Mark D. Smith, Mark D. Smith, John C. Robinson, John C. Robinson, } "Patterned wafer geometry grouping for improved overlay control", Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450O (28 March 2017); doi: 10.1117/12.2257834; https://doi.org/10.1117/12.2257834
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