27 March 2017 Development of TiO2 containing hardmasks through PEALD deposition
Author Affiliations +
With the increasing prevalence of complex device integration schemes, tri layer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination, and are limited in their ability to scale down thickness without comprising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO2 films with wet etch tunability. This paper presents a systematic study on development and characterization of PEALD deposited TiO2-based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a tri layer scheme patterned with PEALD based TiO2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited vs a spin-on metal hardmask.
Conference Presentation
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Anuja De Silva, Anuja De Silva, Indira Seshadri, Indira Seshadri, Kisup Chung, Kisup Chung, Abraham Arceo, Abraham Arceo, Luciana Meli, Luciana Meli, Brock Mendoza, Brock Mendoza, Yasir Sulehria, Yasir Sulehria, Yiping Yao, Yiping Yao, Madhana Sunder, Madhana Sunder, Hao Truong, Hao Truong, Shravan Matham, Shravan Matham, Ruqiang Bao, Ruqiang Bao, Heng Wu, Heng Wu, Nelson M. Felix, Nelson M. Felix, Sivananda Kanakasabapathy, Sivananda Kanakasabapathy, "Development of TiO2 containing hardmasks through PEALD deposition", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014615 (27 March 2017); doi: 10.1117/12.2258380; https://doi.org/10.1117/12.2258380

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