11 April 2017 Process margin improvement through finger-print removal based on scanner leveling data
Author Affiliations +
Abstract
The next generation technology and emerging memory devices require gradually tighter lithographic focus control on imaging critical layers. Especially in case of BEOL process, big PDO (Process Dependent Offset) from large intra-field topography steps affects the process margin directly. There are couple of scanner options to reduce PDO, such as AGILE which provides several benefits. However, for certain use cases the AGILE sensor may not be the optimal solution.

In this paper, we introduce the concept and development background of iFPC (intra-field Finger Print Correction). iFPC is a scanner option that removes the generic 3D fingerprint seen in the leveling data so that both process dependency and actual wafer topography are not followed during wafer exposure.

In addition, we compare the degree of process margin improvement when applying iFPC compared to that of AGILE on a critical layer. The achieved results demonstrate that by applying iFPC it is possible to gain an additional 15~20nm DoF. In other words, on this use case our feasibility suggests that by removing the generic 3D fingerprint seen in the leveling data, it is possible to achieve a better focus performance than when trying to follow the topography during scanning.

In conclusion, we found another good way to improve the process margin through this comparative experiment. Therefore, our next step will be to setup the methodology to select the use cases where iFPC is the optimal solution.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Young Jun Kim, Young Jun Kim, Tony Park, Tony Park, Jeong Heung Kong, Jeong Heung Kong, Dong Kyung Han, Dong Kyung Han, Jin Phil Choi, Jin Phil Choi, Young Seog Kang, Young Seog Kang, Se Yeon Jang, Se Yeon Jang, Jeroen Cottaar, Jeroen Cottaar, Jan-Pieter van Delft, Jan-Pieter van Delft, Jeroen Rutten, Jeroen Rutten, Axel von Sydow, Axel von Sydow, Marcel Bontekoe, Marcel Bontekoe, Maarten Boogaarts, Maarten Boogaarts, Arjan Donkerbroek, Arjan Donkerbroek, Ruiyue Ouyang, Ruiyue Ouyang, Balaji Rangarajan, Balaji Rangarajan, Khalid Elbattay, Khalid Elbattay, Andrew Moe, Andrew Moe, Chung-Yong Kim, Chung-Yong Kim, } "Process margin improvement through finger-print removal based on scanner leveling data", Proc. SPIE 10147, Optical Microlithography XXX, 1014709 (11 April 2017); doi: 10.1117/12.2258184; https://doi.org/10.1117/12.2258184
PROCEEDINGS
12 PAGES + PRESENTATION

SHARE
RELATED CONTENT

UV-NIL templates for the 22nm node and beyond
Proceedings of SPIE (November 16 2007)
Evaluation of color display by polychromatic MTF
Proceedings of SPIE (April 26 2002)
The Manufacture Of Amorphous Silicon Photovoltaic Modules
Proceedings of SPIE (September 08 1983)
Silicon-on-silicon microsystem in plastic packages
Proceedings of SPIE (April 01 1991)

Back to Top