24 March 2017 On-product overlay improvement with an enhanced alignment system
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Abstract
The final lithography accuracy is determined by what is known as the “on-product” performance, which includes product wafer-related errors and long-term stability. It is evident that on-product performance improvement is absolutely imperative now, and will become even more crucial in coming years. In order to meet customers’ future requirements, we have developed the next-generation lithography system focusing on wafer alignment advancements to improve onproduct performance.

This newly developed wafer alignment system will help customers achieve their aggressive next-generation manufacturing accuracy and productivity requirements. In this paper, we describe the details of the new wafer measurement system and provide supporting performance data.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tomonori Dosho, Yuji Shiba, Takanobu Okamoto, Hajime Yamamoto, Yujiro Hikida, Jay Brown, Go Ichinose, Masahiro Morita, Yuichi Shibazaki, "On-product overlay improvement with an enhanced alignment system", Proc. SPIE 10147, Optical Microlithography XXX, 1014716 (24 March 2017); doi: 10.1117/12.2257659; https://doi.org/10.1117/12.2257659
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