28 March 2017 Stitch overlap via coloring technique enables maskless via
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Abstract
Lithographic patterning limits can be a cost-barrier that delays advancement to new nodes. This paper introduces a cost-saving design method that enables a maskless via. Multi-patterning or coloring of a design is a technique that is used at advanced nodes to aid in patterning. Coloring allows designers to designate different patterns on one level to be printed with different masks. Stitch overlap via (SOV) is a coloring technique introduced herein. SOV utilizes via-aware coloring and a unique process flow to print a maskless via. Identification of qualifying design structures is achieved through a custom program. The program inputs the design level of the multipatterned layer and the via levels above and below to determine the coloring decomposition. Vias are a particularly challenging layer to print due to the dimensions required for these pillars. SOV is a methodology for identifying qualifying multi-patterned layouts and replacing them with a new design that enables a maskless via layer.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. Civay, D. Civay, E. Laffosse, E. Laffosse, } "Stitch overlap via coloring technique enables maskless via", Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480R (28 March 2017); doi: 10.1117/12.2258640; https://doi.org/10.1117/12.2258640
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