26 April 2017 Design and pitch scaling for affordable node transition and EUV insertion scenario
Author Affiliations +
Abstract
imec’s DTCO and EUV achievement toward imec 7nm (iN7) technology node which is industry 5nm node equivalent is reported with a focus on cost and scaling. Patterning-aware design methodology supports both iArF multiple patterning and EUV under one compliant design rule. FinFET device with contacted poly pitch of 42nm and metal pitch of 32nm with 7.5-track, 6.5-track, and 6-track standard cell library are explored. Scaling boosters are used to provide additional scaling and die cost benefit while lessening pitch shrink burden, and it makes EUV insertion more affordable. EUV pattern fidelity is optimized through OPC, SMO, M3D, mask sizing and SRAF. Processed wafers were characterized and edge-placement-error (EPE) variability is validated for EUV insertion. Scale-ability and cost of ownership of EUV patterning in aligned with iN7 standard cell design, integration and patterning specification are discussed.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryoung-han Kim, Ryoung-han Kim, Julien Ryckaert, Julien Ryckaert, Praveen Raghavan, Praveen Raghavan, Yasser Sherazi, Yasser Sherazi, Peter Debacker, Peter Debacker, Darko Trivkovic, Darko Trivkovic, Werner Gillijns, Werner Gillijns, Ling Ee Tan, Ling Ee Tan, Youssef Drissi, Youssef Drissi, Victor Blanco, Victor Blanco, Joost Bekaert, Joost Bekaert, Ming Mao, Ming Mao, Stephane Larivière, Stephane Larivière, Greg McIntyre, Greg McIntyre, } "Design and pitch scaling for affordable node transition and EUV insertion scenario", Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480V (26 April 2017); doi: 10.1117/12.2257885; https://doi.org/10.1117/12.2257885
PROCEEDINGS
8 PAGES + PRESENTATION

SHARE
RELATED CONTENT


Back to Top