30 March 2017 Design space analysis of novel interconnect constructs for 22nm FDX technology
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Abstract
In this paper, we describe an integrated design space analysis approach consisting of full factorial layout generation, lithography simulations with added proximity effects, and rigorous statistical analysis through monte-carlo simulations which is used in the evaluating interconnects. This agile Design rule development process provides a quick turnaround time to down-select the potential layout configurations that can offer a competitive, robust and reliable design and manufacturing. Further layout and placement optimization is carried out to evaluate intra-cell, inter-cell and cell boundary situations, which are critical for a place and routed block. These interconnects developed using the integrated approach has been the key contributor to give 20-30% higher performance at the same Iddq leakage for 8T libraries compared to Single Diffusion break or Double Diffusion break based 12T libraries in 22FDX Technology.
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Tuhin Guha Neogi, Tuhin Guha Neogi, Navneet Jain, Navneet Jain, Piyush Verma, Piyush Verma, David Permana, David Permana, Andrey Lutich, Andrey Lutich, Francois Weishbuch, Francois Weishbuch, Deepal Wehella-Gamage, Deepal Wehella-Gamage, Benoit Francois Claude Ramadout, Benoit Francois Claude Ramadout, Gowtham Vangara, Gowtham Vangara, Juhan Kim, Juhan Kim, Thomas Herrmann, Thomas Herrmann, Kai Sun, Kai Sun, Katherina Babich, Katherina Babich, David Pritchard, David Pritchard, Mahbub Rashed, Mahbub Rashed, } "Design space analysis of novel interconnect constructs for 22nm FDX technology", Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480Z (30 March 2017); doi: 10.1117/12.2258668; https://doi.org/10.1117/12.2258668
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