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19 October 2016 Study on the consistency and repeatability of FBG packaging technology
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Proceedings Volume 10155, Optical Measurement Technology and Instrumentation; 1015529 (2016)
Event: International Symposium on Optoelectronic Technology and Application 2016, 2016, Beijing, China
The main research is thermal strain sensing characteristics of epoxy resin in fiber Bragg grating (FBG) packaging process. The results of experiment showed that modified epoxy acrylate resin which is often used to package FBG, occurred glass transition at about 65°C, of which the thermal strain sensing sensitivity decreased. Meanwhile, this study showed that FBG is packaged by the modified epoxy acrylate resin after heat treatment has the effect on strain measurement. The experiment indicated that strain measuring consistency and repeatability of FBG has been significantly improved after heat treatment at high temperature 120°C. Finally, a FBG packaging technology about curable epoxy resin curing at room temperature is proposed, and it can improved strain and temperature measuring consistency and repeatability.
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Yuegang Tan, Yiyang Chen, Ruiya Li, Zhaoxiang Yu, and Yujia Chen "Study on the consistency and repeatability of FBG packaging technology", Proc. SPIE 10155, Optical Measurement Technology and Instrumentation, 1015529 (19 October 2016);

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