Based on the analysis of the test results for the infrared detector array chip components, the fault phenomenon was classified. The main cause of the chip component failure is chip cracking, bad pixel and abnormal output. The reason of the failure has been analyzed deeply. According to analyze the mechanism of the failure, a series of measures which contain filtrating materials and optimizing the manufacturing process of array chip components were used to improve the performance of the chip components and the test pass rate, which is used to meet the needs of the detector performance.
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Xiaonan Zhang, Yingjie He, Jinping Li, "Study on failure analysis of array chip components in IRFPA ," Proc. SPIE 10157, Infrared Technology and Applications, and Robot Sensing and Advanced Control, 1015715 (25 October 2016);