10 November 2016 Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice
Author Affiliations +
Proceedings Volume 10161, 14th International Conference on Optical and Electronic Sensors; 1016103 (2016) https://doi.org/10.1117/12.2244299
Event: 14th International Conference on Optical and Electronic Sensors, 2016, Gdansk, Poland
Abstract
This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Bieniek, G. Janczyk, R. Dobrowolski, K. Wojciechowska, A. Malinowska, A. Panas, M. Nieprzecki, H. Kłos, "Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice", Proc. SPIE 10161, 14th International Conference on Optical and Electronic Sensors, 1016103 (10 November 2016); doi: 10.1117/12.2244299; https://doi.org/10.1117/12.2244299
PROCEEDINGS
8 PAGES


SHARE
Back to Top