5 April 2017 Temperature dependence of electromechanical impedance based bond-line integrity monitoring
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Abstract
Electromechanical impedance (EMI) is an important technique for bond-line integrity monitoring of adhesively bonded joints in automotive and aerospace structures. In the current work, numerical analysis of temperature sensitivity of the EMI technique is performed. The objective is to detect stiffness reduction of the adhesive in the presence of temperature and external mechanical load. Increase in the operating temperature can degrade the bonded piezoelectric material causing misinterpretation of the EMI data. EMI Signal features are numerically investigated to decouple the effect of load and temperature on the piezoelectric material in the mechanically loaded bonded joint. The computational results indicate higher dependence of EM resonance spectrum towards piezoelectric material matrix as compared to the tensile load applied on the bonded sample as the stiffness of adhesive is numerically varied.
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Prathamesh Bilgunde, Leonard J. Bond, "Temperature dependence of electromechanical impedance based bond-line integrity monitoring", Proc. SPIE 10170, Health Monitoring of Structural and Biological Systems 2017, 101702Y (5 April 2017); doi: 10.1117/12.2260365; https://doi.org/10.1117/12.2260365
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