22 December 2016 Electron beam throughput from raster to imaging
Author Affiliations +
Proceedings Volume 10175, Electron Technology Conference 2016; 1017503 (2016) https://doi.org/10.1117/12.2262318
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
Abstract
Two architectures of electron beam tools are presented: single beam MEBES Exara designed and built by Etec Systems for mask writing, and the Reflected E-Beam Lithography tool (REBL), designed and built by KLA-Tencor under a DARPA Agreement No. HR0011-07-9-0007. Both tools have implemented technologies not used before to achieve their goals. The MEBES X, renamed Exara for marketing purposes, used an air bearing stage running in vacuum to achieve smooth continuous scanning. The REBL used 2 dimensional imaging to distribute charge to a 4k pixel swath to achieve writing times on the order of 1 wafer per hour, scalable to throughput approaching optical projection tools. Three stage architectures were designed for continuous scanning of wafers: linear maglev, rotary maglev, and dual linear maglev.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marek Zywno, Marek Zywno, } "Electron beam throughput from raster to imaging", Proc. SPIE 10175, Electron Technology Conference 2016, 1017503 (22 December 2016); doi: 10.1117/12.2262318; https://doi.org/10.1117/12.2262318
PROCEEDINGS
9 PAGES


SHARE
RELATED CONTENT

Overlay leaves litho impact of non litho processes on...
Proceedings of SPIE (October 16 2014)
A raster multibeam lithography tool for sub 100 nm mask...
Proceedings of SPIE (October 14 2003)
PML2 the maskless multibeam solution for the 22nm node...
Proceedings of SPIE (March 18 2009)
Performance appraisal of the ATEQ CORE-2500 in production
Proceedings of SPIE (February 28 1991)
CD control of low-k-factor step-and-scan lithography
Proceedings of SPIE (September 13 2001)
Techniques to inspect SCALPEL masks
Proceedings of SPIE (December 29 1999)

Back to Top