22 December 2016 Integrated testing system FiTest for diagnosis of PCBA
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Proceedings Volume 10175, Electron Technology Conference 2016; 1017504 (2016) https://doi.org/10.1117/12.2259860
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
Abstract
This article presents the innovative integrated testing system FiTest for automatic, quick inspection of printed circuit board assemblies (PCBA) manufactured in Surface Mount Technology (SMT). Integration of Automatic Optical Inspection (AOI), In-Circuit Tests (ICT) and Functional Circuit Tests (FCT) resulted in universal hardware platform for testing variety of electronic circuits. The platform provides increased test coverage, decreased level of false calls and optimization of test duration. The platform is equipped with powerful algorithms performing tests in a stable and repetitive way and providing effective management of diagnosis.
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Arkadiusz Bogdan, Adam Lesniak, "Integrated testing system FiTest for diagnosis of PCBA", Proc. SPIE 10175, Electron Technology Conference 2016, 1017504 (22 December 2016); doi: 10.1117/12.2259860; https://doi.org/10.1117/12.2259860
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