22 December 2016 Voiding in lead-free soldering of components with large solder pads
Author Affiliations +
Proceedings Volume 10175, Electron Technology Conference 2016; 1017506 (2016) https://doi.org/10.1117/12.2258608
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
The paper presents the quantification of void formation in lead-free solder joints underneath bottom terminated components (BTCs) through X-ray inspection. Experiments were designed to investigate how void formation is affected by using vacuum in reflow soldering on the example of light emitted diode (LED) packages on metal core printed circuit boards (PCBs). Convection and vapour phase reflow soldering were used for LED assembly. X-ray inspection system analyzed the statistical distribution, mean value, standard deviation and process capability value Cpk of thermal pads coverage for various technological versions of LEDs.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Barbara Dziurdzia, Barbara Dziurdzia, Janusz Mikołajek, Janusz Mikołajek, } "Voiding in lead-free soldering of components with large solder pads", Proc. SPIE 10175, Electron Technology Conference 2016, 1017506 (22 December 2016); doi: 10.1117/12.2258608; https://doi.org/10.1117/12.2258608


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