22 December 2016 Diagnosis of electronic systems in SMT technological line
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Proceedings Volume 10175, Electron Technology Conference 2016; 1017510 (2016) https://doi.org/10.1117/12.2258604
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
The paper presents test and inspection strategies used in the company Fideltronik Poland, Sucha Beskidzka during the process of assembly of advanced electronic systems. As the example, the manufacturing process of modules for controlling and configuration of charts for video transmission has been analyzed. Various diagnostic methods such as Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), Automated X-ray Inspection AXI and Functional Circuit Test FCT have been used to detect failures at different manufacturing stages of the modules and various repair actions have been proposed .
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Marcin Butor, Marcin Butor, Barbara Dziurdzia, Barbara Dziurdzia, "Diagnosis of electronic systems in SMT technological line", Proc. SPIE 10175, Electron Technology Conference 2016, 1017510 (22 December 2016); doi: 10.1117/12.2258604; https://doi.org/10.1117/12.2258604

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