23 June 2017 Front Matter: Volume 10214
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10214, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.
Bison and Burleigh: Front Matter: Volume 10214

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

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Author(s), "Title of Paper," in Thermosense: Thermal Infrared Applications XXXIX, edited by Paolo Bison, Douglas Burleigh, Proceedings of SPIE Vol. 10214 (SPIE, Bellingham, WA, 2017) Sevendigit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510609297

ISBN: 9781510609303 (electronic)

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  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abdulkadhim, Z., 0P

Akai, Atsushi, 1J

Altenburg, Simon J., 14

Alvandipour, Mehrdad, 0B, 1A

Ancona, Francesco, 0Q

Arora, Vanita, 0G

Beaudoin, Georges, 1H, 1K

Bison, P., 0T, 0Z, 10, 1C

Blednov, Roman G., 0E

Boldrini, S., 1C

Bolduc, Sean, 0H

Bortolin, A., 0T, 0Z

Cadelano, G., 0T, 0Z

Calliari, I., 10

Castelo, A., 0L

Celorrio, R., 0L

Chamberland, Martin, 1H, 1K

Chulkov, A. O., 0U

Crinière, A., 12

Dahal, Rohini, 0B, 1A

De Finis, Rosa, 0Q

Derusova, D. A., 0N

Djupkep Dizeu, Frank Billy, 18

Druzhinin, N. V., 0N

Dua, Geetika, 0G

Dumoulin, J., 12, 13

Famengo, A., 1C

Farley, Vincent, 0O

Fernandes, Henrique, 0I

Ferrarini, G., 0T, 0Z

Feteira, A. M., 0P

Fleuret, Julien R., 0I, 18

Fox, Jason C., 07

Gagnon, Marc-André, 0O

Galietti, Umberto, 0Q, 0X

Genest, Marc, 0I

Gershenson, M., 11

Gorosmendi, I., 0L

Gorostegui-Colinas, E., 0L

Gregory, Elizabeth D., 0Y

Guyot, Éric, 0O

Hamada, Kenichi, 0M

Harman, Rebecca, 0H

Herrera, María S., 0D

Hsieh, Sheng-Jen, 09, 0A

Huff, Roy, 02

Huot, François, 1H, 1K

Ibarra-Castanedo, Clemente, 1H, 1I, 1K

Jalalvand, Azarakhsh, 05

Kato, Yukitaka, 08

Kobayashi, C., 1E

Kordatos, E. Z., 0P

Krankenhagen, Rainer, 14

Krauß, Matthias, 1F

Lagueux, Philippe, 0O

Lama, Norsang, 0B, 1A

Lane, Brandon M., 07

Laurie, Seth, 17

Le Touz, N., 13

Lei, Lei, 0T, 18

Liaigre, Kévin, 1H, 1K

López de Uralde, P., 0L

Maldague, Xavier P. V., 0I, 0T, 18, 1H, 1I, 1K, 1L

Malik, Anav, 0A

Marcotte, Frédérick, 0O

Marino, Dominic J., 0B, 1A

McIntosh, Gregory B., 02

Mendioroz, A., 0L

Merci, Bart, 05

Mishra, Deependra K., 0B, 1A

Monti Hughes, Andrea, 0D

Morikawa, Junko, 08

Morton, Vince, 0O

Moskovchenko, A. I., 0U

Mulaveesala, Ravibabu, 0G

Muniyappa, Amarnath, 0G

Nakamura, Yu, 0M

Nazarov, S., 10

Nekhoroshev, V. O., 0N

Nonaka, Shinichi, 0M

Nugent, Paul W., 17

Ogasawara, N., 1E

Ogino, Yuka, 15

Okutomi, Masatoshi, 15

Oswald-Tranta, Beata, 0S, 0W

Ouellet, Denis, 18

Padra, Claudio, 0D

Palumbo, Davide, 0Q, 0X

Pan, Y.-Y., 0U

Pastor, Elsa, 04

Perilli, Stefano, 0I

Planas, Eulàlia, 04

Riesland, David W., 17

Rios, Oriol, 04

Rossi, S., 0Z, 10, 1C

Sackman, Joseph, 0B, 1A

Sakagami, Takahide, 0M, 1J

Salazar, A., 0L

vii

Proc. of SPIE Vol. 10214 1021401-7

Salva, Natalia, 0D

Santa Cruz, Gustavo A., 0D

Sarasini, Fabrizio, 0I, 0N

Schmidt, Roland, 0S

Schwint, Amanda, 0D

Sfarra, Stefano, 0I, 0N, 18, 1I

Shaw, Joseph A., 17

Shestakov, Ivan L., 0E

Shibata, Takashi, 15

Shiozawa, Daiki, 0M, 1J

Siddiqui, Juned A., 0G

Sojasi, Saeed, 1H, 1K, 1L

Takasu, Hiroki, 08

Tamborrino, Rosanna, 0X

Tanaka, Masayuki, 15

Toullier, T., 13

Trofimov, Vladislav V., 0E

Trofimov, Vyacheslav A., 0E

Tuschl, Christoph, 0S

Umbaugh, David, 1A

Umbaugh, Scott E., 0B, 1A

Valero, Mario M., 04

Vandecasteele, Florian, 04, 05

Vavilov, V. P., 0N, 0U

Verstockt, Steven, 04, 05

Vettermann, Matthias, 1F

Vollheim, Birgit, 1F

Wachs, Marian, 1F

Winfree, William P., 0Y

Yamada, H., 1E

Yeung, Ho, 07

Yousefi, Bardia, 18, 1H, 1I, 1K

Zalameda, Joseph N., 0H, 0Y

Zamengo, Massimiliano, 08

Zhang, Hai, 0I, 18

Zhou, Xunfei, 09, 0A

Conference Committees

Symposium Chair

  • Majid Rabbani, Rochester Institute of Technology (United States)

Symposium Co-chair

  • Robert Fiete, Harris Corporation (United States)

Conference Chair

  • Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

Conference Co-chair

  • Douglas Burleigh, La Jolla Cove Consulting (United States)

Conference Program Committee

  • Andrea Acosta, Colbert Infrared Services (United States)

  • Nicolas Avdelidis, National Technical University of Athens (Greece)

  • Jeff R. Brown, Embry-Riddle Aeronautical University (United States)

  • Fred P. Colbert, Colbert Infrared Services (United States)

  • Amanda K. Criner, Air Force Research Laboratory (United States)

  • Jaap de Vries, FM Global (United States)

  • Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

  • Sheng-Jen (Tony) Hsieh, Texas A&M University (United States)

  • Herbert Kaplan, Honeyhill Technical Company (United States)

  • Timo T. Kauppinen, VTT Technical Research Center of Finland (Finland)

  • Dennis H. LeMieux, Siemens Power Generation, Inc. (United States)

  • Monica Lopez Saenz, IRCAM GmbH (Germany)

  • Gregory B. McIntosh, Teasdale Consultants Ltd. (Canada)

  • Xavier P. V. Maldague, University Laval (Canada)

  • Junko Morikawa, Tokyo Institute of Technology (Japan)

  • Gary L. Orlove, FLIR Systems, Inc. (United States)

  • Beata Oswald-Tranta, Montan Universität Leoben (Austria)

  • G. Raymond Peacock, Temperatures.com, Inc. (United States)

  • Ralph A. Rotolante, Vicon Enterprises Inc. (United States)

  • Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

  • Morteza Safai, The Boeing Company (United States)

  • Takahide Sakagami, Kobe University (Japan)

  • Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

  • Sami Siikanen, VTT Technical Research Center of Finland (Finland)

  • Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (United States)

  • Vladimir P. Vavilov, National Research Tomsk Polytechnic University (Russian Federation)

  • Joseph N. Zalameda, NASA Langley Research Center (United States)

Conference Review Committee

  • Bjørn F. Andresen, RICOR Cryogenic & Vacuum Systems (Israel)

  • Gabor F. Fulop, Maxtech International, Inc. (United States)

  • Gerald C. Holst, JCD Publishing (United States)

  • Keith A. Krapels, U.S. Army Night Vision & Electronic Sensors

    Directorate (United States)

  • Arantza Mendioroz, Universidad del País Vasco (Spain)

Session Chairs

  • 1 Vendor Presentations and Reception: Infrared Applications:

    ThermoSense XXXIX

    Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

    Sheng-Jen Hsieh, Texas A&M University (United States)

  • 2 Standards Certifications and Guidelines

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

    Gregory B. McIntosh, Teasdale Consultants Ltd. (Canada)

  • 3 Fire Analysis and Detection

    Beata Oswald-Tranta, Montan Universität Leoben (Austria)

    Jaap de Vries, FM Global (United States)

  • 4 Additive Manufacturing I

    Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • 5 Additive Manufacturing II

    Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • 6 Biological and Medical Applications

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • 7 NDT and Signal Processing

    Xavier P. V. Maldague, University Laval (Canada)

    Joseph N. Zalameda, NASA Langley Research Center (United States)

  • 8 Vibro-Thermography and Thermomechanics

    Takahide Sakagami, Kobe University (Japan)

    Arantza Mendioroz, Universidad del País Vasco (Spain)

  • 9 NDT and Material Evaluation

    Douglas Burleigh, La Jolla Cove Consulting (United States)

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • 10 Modeling Heat Conduction and Thermophysical Properties

    Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • 11 Buildings and Infrastructures

    Sheng-Jen Hsieh, Texas A&M University (United States)

  • 12 Detectors, Imaging Systems and Calibration

    Junko Morikawa, Tokyo Institute of Technology (Japan)

    Gary L. Orlove, FLIR Systems, Inc. (United States)

Introduction

The Thermosense conference continues to play a significant role in assessing the state-of-the-art, current developments, and future trends in the applications of infrared thermography.

This year, for the first time, Thermosense was held in Anaheim, California (United States), on 9–13 April, 2017.

The international Thermosense community of academic scientists, industry professionals, and students submitted 62 abstracts and made 46 presentations. Countries represented this year included Argentina, Canada, India, Japan, Mexico, Russia, Tajikistan, and the United States, along with a contingent of researchers from European countries including Austria, Belgium, France, Germany, Italy, and the United Kingdom.

Two awards were presented for excellence in scientific achievement. The first award, for the best overall paper, involved the use of IR thermography in large scale applications: the study of buildings and infrastructures. The second was for the best student paper, which involved small/micro scale applications: the study of thermal/mechanical properties of materials.

The awards were sponsored by FLIR Systems Inc. and IRCameras LLC respectively. These two award-winning papers demonstrated the wide range of flexibility of infrared technology.

Other topics of growing interest represented at this year’s Thermosense were the use of thermography in additive manufacturing, in biological and medical applications, and in the ever-growing application of nondestructive testing (NDT).

Thermosense promotes developments in infrared technology by hosting the annual “Vendor” session, which is now in its 13th year. This very popular session is a unique opportunity for people to learn about new equipment, systems, and accessories.

Next year the historic 40th (XL) Thermosense conference will be held in Orlando, Florida (United States) where most of our conferences have been. Many of our dedicated group have been coming to Thermosense for 20–30 years, and a small number attended Thermosense 1.

We will plan some special events for Thermosense XL.

Paolo Bison

Douglas Burleigh

© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 10214", Proc. SPIE 10214, Thermosense: Thermal Infrared Applications XXXIX, 1021401 (23 June 2017); doi: 10.1117/12.2280659; https://doi.org/10.1117/12.2280659
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