To guarantee high performance of Micro Optical Electro Mechanical Systems (MOEMS), precise position feedback is crucial. To overcome drawbacks of widely used optical feedback, we propose an inkjet-printed capacitive position sensor as smart packaging solution. Printing processes suffer from tolerances in excess of those from standard processes. Thus, FEM simulations covering assumed tolerances of the system are adopted. These simulations are structured following a Design Of Computer Experiments (DOCE) and are then employed to determine a optimal sensor design. Based on the simulation results, statistical models are adopted for the dynamic system. These models are to be used together with specifically designed hardware, considered to cope with challenging requirements of ≈50nm position accuracy at 10MS/s with 1000μm measurement range. Noise analysis is performed considering the influence of uncertainties to assess resolution and bandwidth capabilities.
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