10 February 2017 Investigation of skin structures based on infrared wave parameter indirect microscopic imaging
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Proceedings Volume 10250, International Conference on Optical and Photonics Engineering (icOPEN 2016); 102500Q (2017) https://doi.org/10.1117/12.2266770
Event: Fourth International Conference on Optical and Photonics Engineering, 2016, Chengdu, China
Abstract
Detailed imaging and analysis of skin structures are becoming increasingly important in modern healthcare and clinic diagnosis. Nanometer resolution imaging techniques such as SEM and AFM can cause harmful damage to the sample and cannot measure the whole skin structure from the very surface through epidermis, dermis to subcutaneous. Conventional optical microscopy has the highest imaging efficiency, flexibility in onsite applications and lowest cost in manufacturing and usage, but its image resolution is too low to be accepted for biomedical analysis. Infrared parameter indirect microscopic imaging (PIMI) uses an infrared laser as the light source due to its high transmission in skins. The polarization of optical wave through the skin sample was modulated while the variation of the optical field was observed at the imaging plane. The intensity variation curve of each pixel was fitted to extract the near field polarization parameters to form indirect images. During the through-skin light modulation and image retrieving process, the curve fitting removes the blurring scattering from neighboring pixels and keeps only the field variations related to local skin structures. By using the infrared PIMI, we can break the diffraction limit, bring the wide field optical image resolution to sub-200nm, in the meantime of taking advantage of high transmission of infrared waves in skin structures.
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Jun Zhao, Jun Zhao, Xuefeng Liu, Xuefeng Liu, Jichuan Xiong, Jichuan Xiong, Lijuan Zhou, Lijuan Zhou, } "Investigation of skin structures based on infrared wave parameter indirect microscopic imaging", Proc. SPIE 10250, International Conference on Optical and Photonics Engineering (icOPEN 2016), 102500Q (10 February 2017); doi: 10.1117/12.2266770; https://doi.org/10.1117/12.2266770
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