Absorption of edge-cladding Cu-glass for the strong amplified spontaneous emission of Nd-glass disk will produce
a large rise for the temperature and thermal stress near the cladding interface between Cu-glass and Nd-glass.
According to the calculation for amplified spontaneous emission of Nd-glass and thermal stress along the thickness
of Cu-glass, which is produced in our lab, the relations among temperature rise, thermal stress, CuO doping
concentration and thickness of cladding Cu-glass, are discussed in detail. If using 0.10% CuO doping instead of
1%, which was used in the previous time, the maximum temperature will decrease from 46K to 13K and the thermal
stress will decrease from 4.0 MPa to 0.8 MPa. Our edges cladding experimental results, obtained by the low CuO
concentration edge cladding glass, are consistent with the inferences and validated in the SG series laser systems.