8 March 2017 Investigation on the temperature rise and thermal stress of edge-cladding
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Proceedings Volume 10255, Selected Papers of the Chinese Society for Optical Engineering Conferences held October and November 2016; 102550X (2017) https://doi.org/10.1117/12.2264213
Event: Selected Papers of the Chinese Society for Optical Engineering Conferences held October and November 2016, 2016, Jinhua, Suzhou, Chengdu, Xi'an, Wuxi, China
Abstract
Absorption of edge-cladding Cu-glass for the strong amplified spontaneous emission of Nd-glass disk will produce a large rise for the temperature and thermal stress near the cladding interface between Cu-glass and Nd-glass. According to the calculation for amplified spontaneous emission of Nd-glass and thermal stress along the thickness of Cu-glass, which is produced in our lab, the relations among temperature rise, thermal stress, CuO doping concentration and thickness of cladding Cu-glass, are discussed in detail. If using 0.10% CuO doping instead of 1%, which was used in the previous time, the maximum temperature will decrease from 46K to 13K and the thermal stress will decrease from 4.0 MPa to 0.8 MPa. Our edges cladding experimental results, obtained by the low CuO concentration edge cladding glass, are consistent with the inferences and validated in the SG series laser systems.
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Junjiang Hu, Junjiang Hu, Tao Men, Tao Men, Youkuo Chen, Youkuo Chen, Lei Wen, Lei Wen, Hong He, Hong He, Jingping Tang, Jingping Tang, Biao Wang, Biao Wang, Shubin Chen, Shubin Chen, Wei Chen, Wei Chen, Lili Hu, Lili Hu, } "Investigation on the temperature rise and thermal stress of edge-cladding", Proc. SPIE 10255, Selected Papers of the Chinese Society for Optical Engineering Conferences held October and November 2016, 102550X (8 March 2017); doi: 10.1117/12.2264213; https://doi.org/10.1117/12.2264213
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