PROCEEDINGS VOLUME 10284
PHOTONICS WEST '96 | 27 JANUARY - 2 FEBRUARY 1996
Optoelectronic Interconnects and Packaging: A Critical Review
IN THIS VOLUME

1 Sessions, 24 Papers, 0 Presentations
PHOTONICS WEST '96
27 January - 2 February 1996
San Jose, CA, United States
Optoelectronic Interconnects and Packaging 1996
Proc. SPIE 10284, Front Matter: Volume 10284, 1028401 (30 January 1996); doi: 10.1117/12.2285114
Proc. SPIE 10284, Vertical-cavity surface-emitting lasers for free-space interconnects, 1028402 (30 January 1996); doi: 10.1117/12.229262
Proc. SPIE 10284, Low-power approaches for parallel free-space photonic interconnects, 1028403 (30 January 1996); doi: 10.1117/12.229271
Proc. SPIE 10284, Board-to-board free-space optical interconnects of bus architecture, 1028404 (30 January 1996); doi: 10.1117/12.229279
Proc. SPIE 10284, Smart multichip module communications using free-space optical interconnects, 1028405 (30 January 1996); doi: 10.1117/12.229280
Proc. SPIE 10284, Multilevel phase holograms for free-space optical interconnects: design and analysis, 1028407 (30 January 1996); doi: 10.1117/12.229281
Proc. SPIE 10284, Integrated optoelectronic interconnects using liquid-crystal-on-silicon VLSI, 1028408 (30 January 1996); doi: 10.1117/12.229282
Proc. SPIE 10284, VCSEL array-based optoelectronic crossbar interconnect, 1028409 (30 January 1996); doi: 10.1117/12.229283
Proc. SPIE 10284, Optoelectronic parallel computing system with reconfigurable optical interconnection, 102840A (30 January 1996); doi: 10.1117/12.229284
Proc. SPIE 10284, Network-related performance issues and techniques for MPPs, 102840B (30 January 1996); doi: 10.1117/12.229263
Proc. SPIE 10284, VCSEL-based optical interconnections at interbox distances and shorter, 102840C (30 January 1996); doi: 10.1117/12.229264
Proc. SPIE 10284, Design and fabrication of low-power 1-Gb/s OEIC receivers, 102840D (30 January 1996); doi: 10.1117/12.229265
Proc. SPIE 10284, Clock recovery for high-speed optical communication, 102840E (30 January 1996); doi: 10.1117/12.229266
Proc. SPIE 10284, Performance-optimized optical bidirectional backplane bus for multiprocessor systems, 102840G (30 January 1996); doi: 10.1117/12.229267
Proc. SPIE 10284, Intracomputer optical interconnects: progress and challenges, 102840H (30 January 1996); doi: 10.1117/12.229268
Proc. SPIE 10284, Optical interconnection using polyimide waveguide for multichip module, 102840J (30 January 1996); doi: 10.1117/12.229269
Proc. SPIE 10284, Implementation of optical interconnects in the GigaRing supercomputer channel, 102840K (30 January 1996); doi: 10.1117/12.229270
Proc. SPIE 10284, Optoelectronic interconnects for 3D wafer stacks, 102840L (30 January 1996); doi: 10.1117/12.229272
Proc. SPIE 10284, POLO: a gigabyte/s parallel optical link, 102840M (30 January 1996); doi: 10.1117/12.229273
Proc. SPIE 10284, Polymer optical interconnect technology (POINT): optoelectronic packaging and interconnect for board and backplane applications, 102840N (30 January 1996); doi: 10.1117/12.229274
Proc. SPIE 10284, Fabrication and performance of optical-interconnect analog-phase holograms made by electron-beam lithography, 102840O (30 January 1996); doi: 10.1117/12.229275
Proc. SPIE 10284, Packaging and applications of active polymer optical switching arrays, 102840Q (30 January 1996); doi: 10.1117/12.229276
Proc. SPIE 10284, Potential of LIGA technology for optoelectronic interconnects, 102840R (30 January 1996); doi: 10.1117/12.229277
Proc. SPIE 10284, Bit-parallel wavelength links for high-performance computer networks, 102840S (30 January 1996); doi: 10.1117/12.229278
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