30 January 1996 Front Matter: Volume 10284
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10284, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.
Front Matter: Volume 10284

Conference Committee

Conference Chairs

  • Ray T. Chen, University of Texas/Austin

  • Peter S. Guilfoyle, OptiComp Corporation

Session Chairs

  • 1 Free-Space Optoelectronic Interconnects

    Peter S. Guilfoyle, OptiComp Corporation

  • 2 Interconnect Architectures

    Julian P. Bristow, Honeywell Inc.

  • 3 High-Speed Transceivers for Optoelectronic Interconnects

    Yao Li, NEC Research Institute

  • 4 Backplane Optoelectronic Interconnects

    Randy W. Wickman, Cray Research Inc.

  • 5 Intra- and Inter-MCM Optoelectronic Interconnects

    Yung S. Liu, GE Corporate Research and Development Center

  • 6 Optoelectronic Packaging

    Ray T. Chen, University of Texas/Austin

Preface

Optoelectronic interconnects and packaging are becoming increasingly important due to the requirement of high-speed, large-capacity transmission of information. Such a demand in many scenarios such as machine-to-machine and module-to-module interconnects can only be realized by employing optoelectronic technology.

In this critical review, we have invited 26 internationally known experts in this field to address such critical technical issues as vertical cavity surface emitting lasers, photodetectors, holograms and smart pixel arrays for both guided wave and free-space optoelectronic interconnects. Architecture-related subjects are also delineated to provide a global picture of future development. Several system demonstrations, including 500-MHz optical clock signal distribution for Cray Research’s T-90 machine, ARPA-sponsoredPOINT and POLO programs, and the most recent developments on optoelectronic packaging are also detailed in this book.

We expect the engineers, scientists, and students in this field to find this book useful for their research.

Ray T. Chen

Peter S. Guilfoyle

© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 10284", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 1028401 (30 January 1996); doi: 10.1117/12.2285114; https://doi.org/10.1117/12.2285114
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