30 January 1996 Board-to-board free-space optical interconnects of bus architecture
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This paper presents the concepts of a board-to-board free space optical interconnection scheme that will support a bus architecture. While the technology required to implement this optical scheme is very compatible with existing electronic packaging technologies, it promises to be able interconnect many more boards together without serious impedance matching or termination problems encountered by electrical interconnects at high speed. Experimental demonstration of the optical scheme is in progress.
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Jian Ma, Jian Ma, Volkan H. Ozguz, Volkan H. Ozguz, Sing H. Lee, Sing H. Lee, } "Board-to-board free-space optical interconnects of bus architecture", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 1028404 (30 January 1996); doi: 10.1117/12.229279; https://doi.org/10.1117/12.229279

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