30 January 1996 Board-to-board free-space optical interconnects of bus architecture
Author Affiliations +
Abstract
This paper presents the concepts of a board-to-board free space optical interconnection scheme that will support a bus architecture. While the technology required to implement this optical scheme is very compatible with existing electronic packaging technologies, it promises to be able interconnect many more boards together without serious impedance matching or termination problems encountered by electrical interconnects at high speed. Experimental demonstration of the optical scheme is in progress.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jian Ma, Volkan H. Ozguz, Sing H. Lee, "Board-to-board free-space optical interconnects of bus architecture", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 1028404 (30 January 1996); doi: 10.1117/12.229279; https://doi.org/10.1117/12.229279
PROCEEDINGS
4 PAGES


SHARE
Back to Top