30 January 1996 Intracomputer optical interconnects: progress and challenges
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Abstract
Several interconnect Junctions within cabinets comprising high performance computers are pushing the limits of electrical interconnect technology. A widespread problem of limited interconnect density at the board-to-backplane interface has been identified, while advances in clock speed and cabinet functionality are expected to stress electrical interconnects first for high fanout applications, then for high speed point-to-point parallel interconnects. Key components are described, and from these components the design of a generic optical backplane technology is described. While components are now available to implement a practical solution, the use of proven electrical techniques is considered an important step in hastening the introduction of the technology.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Julian Bristow, Julian Bristow, } "Intracomputer optical interconnects: progress and challenges", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840H (30 January 1996); doi: 10.1117/12.229268; https://doi.org/10.1117/12.229268
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