30 January 1996 Optoelectronic interconnects for 3D wafer stacks
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Abstract
Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Ludwig, David Ludwig, John C. Carson, John C. Carson, Louis S. Lome, Louis S. Lome, } "Optoelectronic interconnects for 3D wafer stacks", Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840L (30 January 1996); doi: 10.1117/12.229272; https://doi.org/10.1117/12.229272
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