PROCEEDINGS VOLUME 10292
OPTOELECTRONICS AND HIGH-POWER LASERS AND APPLICATIONS | 24-30 JANUARY 1998
Heterogeneous Integration: Systems on a Chip: A Critical Review
IN THIS VOLUME

1 Sessions, 11 Papers, 0 Presentations
OPTOELECTRONICS AND HIGH-POWER LASERS AND APPLICATIONS
24-30 January 1998
San Jose, CA, United States
Heterogeneous Integration: Systems on a Chip
Proc. SPIE 10292, Front Matter: Volume 10292, 1029201 (27 January 1998); https://doi.org/10.1117/12.2284217
Proc. SPIE 10292, Large-scale monolithic integration technologies for InP-based transmitters and receivers, 1029203 (27 January 1998); https://doi.org/10.1117/12.300612
Proc. SPIE 10292, Fusion bonding: hetero-interfacial materials analysis and device application, 1029204 (27 January 1998); https://doi.org/10.1117/12.300613
Proc. SPIE 10292, Compliant substrate technology for heterogeneous integration, 1029205 (27 January 1998); https://doi.org/10.1117/12.300614
Proc. SPIE 10292, Dense two-dimensional integration of optoelectronics and electronics for interconnections, 1029206 (27 January 1998); https://doi.org/10.1117/12.300615
Proc. SPIE 10292, DNA-assisted microassembly: a hetrogeneous integration technology for optoelectronics, 1029208 (27 January 1998); https://doi.org/10.1117/12.300616
Proc. SPIE 10292, Native oxide technology for III-V optoelectronic devices, 1029209 (27 January 1998); https://doi.org/10.1117/12.300617
Proc. SPIE 10292, VCSEL-based smart pixels and their applications, 102920A (27 January 1998); https://doi.org/10.1117/12.300618
Proc. SPIE 10292, VCSEL-based optoelectronic smart pixels, 102920C (27 January 1998); https://doi.org/10.1117/12.300609
Proc. SPIE 10292, Status of optoelectronic-VLSI technology based on electroabsorption modulators, 102920D (27 January 1998); https://doi.org/10.1117/12.300610
Proc. SPIE 10292, Integration of AlGaAs devices, 102920E (27 January 1998); https://doi.org/10.1117/12.300611
Back to Top