27 January 1998 Fusion bonding: hetero-interfacial materials analysis and device application
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A large number of novel devices have been recently demonstrated using wafer fusion to integrate materials with different lattice constants. In many cases, devices created using this technique have shown dramatic improvements over those which maintain a single lattice constant. We present device results and characterizations of the fused interface between several groups of materials.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. A. Black, K. A. Black, Aaron R. Hawkins, Aaron R. Hawkins, Near M. Margalit, Near M. Margalit, Dubravko I. Babic, Dubravko I. Babic, Archie L. Holmes, Archie L. Holmes, Ying-Lan Chang, Ying-Lan Chang, P. Abraham, P. Abraham, John Edward Bowers, John Edward Bowers, Evelyn L. Hu, Evelyn L. Hu, "Fusion bonding: hetero-interfacial materials analysis and device application", Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029204 (27 January 1998); doi: 10.1117/12.300613; https://doi.org/10.1117/12.300613

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