27 January 1998 Dense two-dimensional integration of optoelectronics and electronics for interconnections
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Optics has many features, beyond those already exploited in long-distance fiber communications, that make it interesting for interconnections at short distance, including dense optical interconnections directly to silicon integrated circuit chips. Hybrid technologies, such as solder-bump bonding, have recently been successfully used to attach two-dimensional arrays of optical detectors, emitters, and modulators to silicon electronics. Quantum well modulator or self-electro-optic-effect devices (SEEDs), and vertical-cavity surface-emitting lasers (VCSELs) have received particularly strong attention as candidates for the necessary arrayed output devices. This article summarizes the research and prospects in these fields.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David A. B. Miller "Dense two-dimensional integration of optoelectronics and electronics for interconnections", Proc. SPIE 10292, Heterogeneous Integration: Systems on a Chip: A Critical Review, 1029206 (27 January 1998); doi: 10.1117/12.300615; https://doi.org/10.1117/12.300615

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