29 August 2017 Challenges in the optical alignment of optoelectronic components
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Proceedings Volume 10313, Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging; 103134Z (2017) https://doi.org/10.1117/12.2283975
Event: Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging, 2002, Ottawa, Ontario, Canada
Abstract
The packaging of optoelectronic components presents many challenges related to the optical alignment of optical and optoelectronic components, due to very precise placement requirements, the demand for long term reliability and environmental insensitivity, and also for a fast and cost effective packaging process. This paper focuses on techniques used for precise optical alignment and the challenges related to their use, analyzed in the context of the whole optoelectronics packaging process.
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Amelia G. Grobnic, "Challenges in the optical alignment of optoelectronic components", Proc. SPIE 10313, Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging, 103134Z (29 August 2017); doi: 10.1117/12.2283975; https://doi.org/10.1117/12.2283975
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