Mirror grinding of silicon with EPD pellets: applying a constant pressure machining

Hideo Shibutani

doi:10.1117/12.2284006

19 May 2003 Mirror grinding of silicon with EPD pellets: applying a constant pressure machining

Hideo Shibutani

Proceedings Volume 10314, Optifab 2003: Technical Digest; 103140H (2003) https://doi.org/10.1117/12.2284006
Event: OptiFab 2003, 2003, Rochester, NY, United States

Abstract

In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nmRa on the silicon wafers. The highest grinding ratio was about 2.0, twice as much as case of ordinary constant infeed grinding.

Citation Download Citation

Hideo Shibutani "Mirror grinding of silicon with EPD pellets: applying a constant pressure machining", Proc. SPIE 10314, Optifab 2003: Technical Digest, 103140H (19 May 2003); https://doi.org/10.1117/12.2284006

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