19 May 2003 Mirror grinding of silicon with EPD pellets: applying a constant pressure machining
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Abstract
In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nmRa on the silicon wafers. The highest grinding ratio was about 2.0, twice as much as case of ordinary constant infeed grinding.
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Hideo Shibutani, Hideo Shibutani, } "Mirror grinding of silicon with EPD pellets: applying a constant pressure machining", Proc. SPIE 10314, Optifab 2003: Technical Digest, 103140H (19 May 2003); doi: 10.1117/12.2284006; https://doi.org/10.1117/12.2284006
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