10 February 2017 Modeling and characterization of optical TSVs
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Proceedings Volume 10325, Optical Fibers and Their Applications 2017; 103250O (2017) https://doi.org/10.1117/12.2270994
Event: 17th Conference on Optical Fibres and Their Applications, 2017, Supraśl, Poland, Poland
In future, computing platforms will invoke massive parallelism by using a huge number of processing elements. These elements need broadband interconnects to communicate with each other. Following More-than-Moore concepts, soon large numbers of processors will be arranged in 3D chip-stacks. This trend to stack multiple dies produces a demand for high-speed intraconnects (within the 3D stack) which enable an efficient operation. Besides wireless electronic solutions (inductive or capacitive as well as using antennas), optical connectivity is an option for bit rates up to the Tbit/s range, too. We investigated different candidates for optical TSVs. For optical transmission via optical Through-Silicon-Vias, we were able to demonstrate negligible losses and dispersion.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Niels Neumann, Niels Neumann, Sujay Charania, Sujay Charania, Sebastian Killge, Sebastian Killge, Zaid al-Husseini, Zaid al-Husseini, Ronny Henker, Ronny Henker, Frank Ellinger, Frank Ellinger, Johann Bartha, Johann Bartha, Dirk Plettemeier, Dirk Plettemeier, } "Modeling and characterization of optical TSVs", Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250O (10 February 2017); doi: 10.1117/12.2270994; https://doi.org/10.1117/12.2270994

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