10 February 2017 Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication
Author Affiliations +
Proceedings Volume 10325, Optical Fibers and Their Applications 2017; 103250V (2017) https://doi.org/10.1117/12.2271046
Event: 17th Conference on Optical Fibres and Their Applications, 2017, Supraśl, Poland, Poland
This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on planar polymeric optical multimode waveguides with integrated out-of-plane coupling optics and optical transceiver subassemblies based on glass interposer. Integration of polymeric waveguides on flexible substrates will be shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electrooptical printed circuit board (EOPCB). Realized on-board waveguides feature low insertion loss (minimum attenuation coefficient of below 0.1 dB/cm). For short planar waveguides (Lwaveguide = 9 cm) error free transmission (BER < 10-12) up to 30 Gbit/s was achieved. The development of glass interposer passive optical coupling structures for VCSEL-based short-distance links will be described.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Krzysztof Nieweglowski, Krzysztof Nieweglowski, Tobias Tiedje, Tobias Tiedje, David Schöniger, David Schöniger, Ronny Henker, Ronny Henker, Frank Ellinger, Frank Ellinger, Karlheinz Bock, Karlheinz Bock, "Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication ", Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250V (10 February 2017); doi: 10.1117/12.2271046; https://doi.org/10.1117/12.2271046

Back to Top