15 June 2017 Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools
Author Affiliations +
Proceedings Volume 10326, Fourth European Seminar on Precision Optics Manufacturing; 1032605 (2017) https://doi.org/10.1117/12.2269500
Event: Fourth European Seminar on Precision Optics Manufacturing, 2017, Teisnach, Germany
Abstract
The fabrication of high-quality optical components involves great effort. Polishing often functions as the final step in a manufacturing chain. To reduce the conventionally time-consuming, complex polishing process with loose grain, an interesting approach with novel resin bond grinding tools is presented for surface smoothing. Various processing-experiments were carried out, regarding different silicate materials such as BK7® and fused silica. Among other results it is shown, that good surface qualities with low roughness down to Ra = 8 nm or Rq = 10 nm can be achieved so far, a quality that already allows speaking of “ultra-fine” grinding. This results in remarkable possibilities to reduce conventional fine-machining procedures with loose abrasives. The fine grinded components can directly be polished to finally smooth the surface and remove remaining defects. Total-processing-times can be strongly reduced, involving significant economic advantages.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sebastian Henkel, Sebastian Henkel, Jens Bliedtner, Jens Bliedtner, Edda Rädlein, Edda Rädlein, Christian Schulze, Christian Schulze, Matthias Rost, Matthias Rost, Martin Gerhardt, Martin Gerhardt, Michael Fuhr, Michael Fuhr, } "Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools", Proc. SPIE 10326, Fourth European Seminar on Precision Optics Manufacturing, 1032605 (15 June 2017); doi: 10.1117/12.2269500; https://doi.org/10.1117/12.2269500
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT


Back to Top