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15 June 2017 Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools
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Proceedings Volume 10326, Fourth European Seminar on Precision Optics Manufacturing; 1032605 (2017) https://doi.org/10.1117/12.2269500
Event: Fourth European Seminar on Precision Optics Manufacturing, 2017, Teisnach, Germany
Abstract
The fabrication of high-quality optical components involves great effort. Polishing often functions as the final step in a manufacturing chain. To reduce the conventionally time-consuming, complex polishing process with loose grain, an interesting approach with novel resin bond grinding tools is presented for surface smoothing. Various processing-experiments were carried out, regarding different silicate materials such as BK7® and fused silica. Among other results it is shown, that good surface qualities with low roughness down to Ra = 8 nm or Rq = 10 nm can be achieved so far, a quality that already allows speaking of “ultra-fine” grinding. This results in remarkable possibilities to reduce conventional fine-machining procedures with loose abrasives. The fine grinded components can directly be polished to finally smooth the surface and remove remaining defects. Total-processing-times can be strongly reduced, involving significant economic advantages.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sebastian Henkel, Jens Bliedtner, Edda Rädlein, Christian Schulze, Matthias Rost, Martin Gerhardt, and Michael Fuhr "Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools", Proc. SPIE 10326, Fourth European Seminar on Precision Optics Manufacturing, 1032605 (15 June 2017); https://doi.org/10.1117/12.2269500
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