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26 June 2017 Speckle-interferometric measurement system of 3D deformation to obtain thickness changes of thin specimen under tensile loads
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The analysis of materials and geometries in tensile tests and the extraction of mechanic parameters is an important field in solid mechanics. Especially the measurement of thickness changes is important to obtain accurate strain information of specimens under tensile loads. Current optical measurement methods comprising 3D digital image correlation enable thickness-change measurement only with nm-resolution. We present a phase-shifting electronic speckle-pattern interferometer in combination with speckle-correlation technique to measure the 3D deformation. The phase-shift for the interferometer is introduced by fast wavelength tuning of a visible diode laser by injection current. In a post-processing step, both measurements can be combined to reconstruct the 3D deformation. In this contribution, results of a 3Ddeformation measurement for a polymer membrane are presented. These measurements show sufficient resolution for the detection of 3D deformations of thin specimen in tensile test. In future work we address the thickness changes of thin specimen under tensile loads.
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Robert Kowarsch, Jiajun Zhang, Carmen Sguazzo, Stefan Hartmann, and Christian Rembe "Speckle-interferometric measurement system of 3D deformation to obtain thickness changes of thin specimen under tensile loads", Proc. SPIE 10329, Optical Measurement Systems for Industrial Inspection X, 103291O (26 June 2017);


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