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26 June 2017 Correlation plenoptic imaging
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Plenoptic Imaging (PI) is a novel optical technique for achieving tridimensional imaging in a single shot. In conventional PI, a microlens array is inserted in the native image plane and the sensor array is moved behind the microlenses. On the one hand, the microlenses act as imaging pixels to reproduce the image of the scene; on the other hand, each microlens reproduces on the sensor array an image of the camera lens, thus providing the angular information associated with each imaging pixel. The recorded propagation direction is exploited, in post- processing, to computationally retrace the geometrical light path, thus enabling the refocusing of different planes within the scene, the extension of the depth of field of the acquired image, as well as the 3D reconstruction of the scene. However, a trade-off between spatial and angular resolution is built in the standard plenoptic imaging process. We demonstrate that the second-order spatio-temporal correlation properties of light can be exploited to overcome this fundamental limitation. Using two correlated beams, from either a chaotic or an entangled photon source, we can perform imaging in one arm and simultaneously obtain the angular information in the other arm. In fact, we show that the second order correlation function possesses plenoptic imaging properties (i.e., it encodes both spatial and angular information), and is thus characterized by a key re-focusing and 3D imaging capability. From a fundamental standpoint, the plenoptic application is the first situation where the counterintuitive properties of correlated systems are effectively used to beat intrinsic limits of standard imaging systems. From a practical standpoint, our protocol can dramatically enhance the potentials of PI, paving the way towards its promising applications.
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Francesco V. Pepe, Francesco Di Lena, Augusto Garuccio, and Milena D'Angelo "Correlation plenoptic imaging", Proc. SPIE 10333, Optical Methods for Inspection, Characterization, and Imaging of Biomaterials III, 103330W (26 June 2017);

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