26 June 2017 See-through 3D technology for augmented reality
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Proceedings Volume 10335, Digital Optical Technologies 2017; 1033502 (2017) https://doi.org/10.1117/12.2276674
Event: SPIE Digital Optical Technologies, 2017, Munich, Germany
Augmented reality is recently attracting a lot of attention as one of the most spotlighted next-generation technologies. In order to get toward realization of ideal augmented reality, we need to integrate 3D virtual information into real world. This integration should not be noticed by users blurring the boundary between the virtual and real worlds. Thus, ultimate device for augmented reality can reconstruct and superimpose 3D virtual information on the real world so that they are not distinguishable, which is referred to as see-through 3D technology. Here, we introduce our previous researches to combine see-through displays and 3D technologies using emerging optical combiners: holographic optical elements and index matched optical elements. Holographic optical elements are volume gratings that have angular and wavelength selectivity. Index matched optical elements are partially reflective elements using a compensation element for index matching. Using these optical combiners, we could implement see-through 3D displays based on typical methodologies including integral imaging, digital holographic displays, multi-layer displays, and retinal projection. Some of these methods are expected to be optimized and customized for head-mounted or wearable displays. We conclude with demonstration and analysis of fundamental researches for head-mounted see-through 3D displays.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Byoungho Lee, Byoungho Lee, Seungjae Lee, Seungjae Lee, Gang Li, Gang Li, Changwon Jang, Changwon Jang, Jong-Young Hong, Jong-Young Hong, } "See-through 3D technology for augmented reality", Proc. SPIE 10335, Digital Optical Technologies 2017, 1033502 (26 June 2017); doi: 10.1117/12.2276674; https://doi.org/10.1117/12.2276674

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