6 September 2017 Development of batch producible hot embossing 3D nanostructured surface-enhanced Raman scattering chip technology
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Abstract
The main purpose of this study is to develop a batch producible hot embossing 3D nanostructured surface-enhanced Raman chip technology for high sensitivity label-free plasticizer detection. This study utilizing the AAO self-assembled uniform nano-hemispherical array barrier layer as a template to create a durable nanostructured nickel mold. With the hot embossing technique and the durable nanostructured nickel mold, we are able to batch produce the 3D Nanostructured Surface-enhanced Raman Scattering Chip with consistent quality. In addition, because of our SERS chip can be fabricated by batch processing, the fabrication cost is low. Therefore, the developed method is very promising to be widespread and extensively used in rapid chemical and biomolecular detection applications.
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Chu-Yu Huang, Chu-Yu Huang, Ming-Shiuan Tsai, Ming-Shiuan Tsai, } "Development of batch producible hot embossing 3D nanostructured surface-enhanced Raman scattering chip technology", Proc. SPIE 10356, Nanostructured Thin Films X, 103560R (6 September 2017); doi: 10.1117/12.2270472; https://doi.org/10.1117/12.2270472
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