1 May 1989 Critical Issues In The Design Of Inspection Systems For Clean Surfaces
Author Affiliations +
Proceedings Volume 1036, Precision Instrument Design; (1989) https://doi.org/10.1117/12.950963
Event: SPIE Advanced Processing Technologies for Optical and Electronic Devices (colocated wth OPTCON), 1988, Santa Clara, CA, United States
Abstract
Surface defect measurements are important in several industries. In semiconductor manufacturing, surface defect measurements are made during final inspection by the slice vendor, at incoming inspection by the circuit fabricator and before certain key operations. The principal requirements of the inspection systems are a low defect diameter detection threshold, good repeatability, high throughput and that they add very few particles of critical diameter. These functional requirements lead to sometimes conflicting design requirements for the optical measuring subsystems. We examine the key design requirements for future inspection equipment, and compare approaches used in commercially available equipment.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David M. Berg, Joachim Bunkenburg, Charles J. Cushing, "Critical Issues In The Design Of Inspection Systems For Clean Surfaces", Proc. SPIE 1036, Precision Instrument Design, (1 May 1989); doi: 10.1117/12.950963; https://doi.org/10.1117/12.950963
PROCEEDINGS
9 PAGES


SHARE
RELATED CONTENT

Scatteroscope for testing polished surfaces
Proceedings of SPIE (April 01 2003)
Reticle Contamination Monitor For A Wafer Stepper
Proceedings of SPIE (June 29 1984)
Automatic Inspection Of Contaminants On Reticles
Proceedings of SPIE (June 29 1984)
Contamination Detection On Semiconductor Wafers
Proceedings of SPIE (September 01 1987)

Back to Top