23 August 2017 Mitigation of PID in commercial PV modules using current interruption method
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Abstract
Potential-induced degradation (PID) is known to have a very severe effect on the reliability of PV modules. PID is caused due to the leakage of current from the cell circuit to the grounded frame under humid conditions of high voltage photovoltaic (PV) systems. There are multiple paths for the current leakage. The most dominant leakage path is from the cell to the frame through encapsulant, glass bulk and glass surface. This dominant path can be prevented by interrupting the electrical conductivity at the glass surface. In our previous works related to this topic, we demonstrated the effectiveness of glass surface conductivity interruption technique using one-cell PV coupons. In this work, we demonstrate the effectiveness of this technique using a full size commercial module susceptible to PID. The interruption of surface conductivity of the commercial module was achieved by attaching a narrow, thin flexible glass strips, from Corning, called Willow Glass on the glass surface along the inner edges of the frame. The flexible glass strip was attached to the module glass surface by heating the glass strip with an ionomer adhesive underneath using a handheld heat gun. The PID stress test was performed at 60°C and 85% RH for 96 hours at −600 V. Pre- and post-PID characterizations including I-V and electroluminescence were carried out to determine the performance loss and affected cell areas. This work demonstrates that the PID issue can be effectively addressed by using this current interruption technique. An important benefit of this approach is that this interruption technique can be applied after manufacturing the modules and after installing the modules in the field as well.
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Birinchi Bora, Jaewon Oh, Sai Tatapudi, Oruganty S. Sastry, Rajesh Kumar, Basudev Prasad, Govindasamy Tamizhmani, "Mitigation of PID in commercial PV modules using current interruption method", Proc. SPIE 10370, Reliability of Photovoltaic Cells, Modules, Components, and Systems X, 103700D (23 August 2017); doi: 10.1117/12.2281112; https://doi.org/10.1117/12.2281112
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