22 June 1989 Opto-Mechanical Packaging For Extended Temperature Performance
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Proceedings Volume 1043, Laser Diode Technology and Applications; (1989) https://doi.org/10.1117/12.976389
Event: OE/LASE '89, 1989, Los Angeles, CA, United States
Abstract
The ability of a laser diode module package to maintain precise laser-to-fiber alignment with mechanical stress or temperature change is critical for stable performance. This paper examines an optical-mechanical package configuration in which both laser and fiber are mounted on the same surface with high-temperature solder, thereby minimizing degraded package performance caused by exteraneous thermal or mechanical changes.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott Enochs, "Opto-Mechanical Packaging For Extended Temperature Performance", Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); doi: 10.1117/12.976389; https://doi.org/10.1117/12.976389
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