22 June 1989 Packaging Considerations For Semiconductor Laser Diodes
Author Affiliations +
Proceedings Volume 1043, Laser Diode Technology and Applications; (1989) https://doi.org/10.1117/12.976388
Event: OE/LASE '89, 1989, Los Angeles, CA, United States
The design considerations involved in the primary packaging of semiconductor laser diodes are major factors in the performance, reliability, cost and ultimate commercial success or failure of the finished device. The requirements of the package are as varied as the uses to which semiconductor laser diodes are put; they include such considerations as physical outline, ruggedness, mechanical stability, thermal efficiency, electrical characteristics, unit cost, and handlability. The experience gained by device designers and manufacturers through development and commercial production of semiconductor laser diodes provides the data base from which design proposals are made for new products. However, performance requirements are increasing significantly beyond previous experience and both chip and packaging design engineers are having to turn to new materials and novel design methods to meet these challenges.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alan J. Perryman, James D. Regan, Ross T. Elliott, "Packaging Considerations For Semiconductor Laser Diodes", Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); doi: 10.1117/12.976388; https://doi.org/10.1117/12.976388


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