26 October 2017 Noninvasive encapsulated fiber optic probes for interferometric measurement
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Abstract
This article focuses on the sensitivity of encapsulated interferometric probes. These probes are used mainly for BioMed and security applications. Fiber-optic sensors are interesting for these applications, as they are resistant to electromagnetic interference (EMI) and that also do not affect the surrounding medical and security equipment. Using a loop of the optical fiber with is not a suitable for these measurements. The optical fiber should be fixed to one position, and should not significantly bend. For these reasons, the optical fiber is encapsulated. Furthermore, it is necessary that the encapsulated measuring probes were flexible, inert, water resistant and not toxic. Fiber-optic sensors shouldn't be magnetically active, so they can be used for example, in magnetic resonance environments (MR). Probes meeting these requirements can be widely used in health care and security applications. Encapsulation of interferometric measuring arm brings changes in susceptibility of measurements in comparison with the optical fiber without encapsulation. To evaluate the properties of the encapsulated probes, series of probes made from different materials for encapsulation was generated, using two types of optical fibers with various degrees of protection. Comparison of the sensitivity of different encapsulated probes was performed using a series of measurements at various frequencies. The measurement results are statistically compared in the article and commented. Given the desired properties polydimethylsiloxane (PDMS) polymer has been proven the most interesting encapsulating material for further research.
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O. Zboril, O. Zboril, J. Cubik, J. Cubik, S. Kepak, S. Kepak, J. Nedoma, J. Nedoma, M. Fajkus, M. Fajkus, P. Zavodny, P. Zavodny, V. Vasinek, V. Vasinek, } "Noninvasive encapsulated fiber optic probes for interferometric measurement", Proc. SPIE 10440, Optical Materials and Biomaterials in Security and Defence Systems Technology XIV, 104400K (26 October 2017); doi: 10.1117/12.2277923; https://doi.org/10.1117/12.2277923
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