10 October 2017 Front Matter: Volume 10446
Proceedings Volume 10446, 33rd European Mask and Lithography Conference; 1044601 (2017) https://doi.org/10.1117/12.2302899
Event: 33rd European Mask and Lithography Conference, 2017, Dresden, Germany
This PDF file contains the front matter associated with SPIE Proceedings Volume 10446, including the Title Page, Copyright information, Table of Contents, Foreword, and Conference Committee listing.

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

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Please use the following format to cite material from these proceedings:

Author(s), “Title of Paper,” in 33rd European Mask and Lithography Conference, edited by Uwe F.W. Behringer, Jo Finders, Proceedings of SPIE Vol. 10446 (SPIE, Bellingham, WA, 2017) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510613560

ISBN: 9781510613577 (electronic)

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Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Adam, Kostas, 0V

Arat, Kerim T., 0G

Ausserhuber, H., 0Z

Bahrig, L., 0T

Besacier, Maxime, 0L

Bilski, Bartosz, 05

Bolten, Jens, 0G

Borisov, Michael V., 0X

Bork, Ingo, 0B

Buck, Peter, 0B

Burbine, Andrew, 0V

Buttgereit, Ute, 0V

Caspary, D., 0T

Chaudhary, Narendra, 0C

Chelyubeev, Dmitry A., 0X

Chen, Ao, 0V

Chernik, Vitaly V., 0X

Chidambaram, N., 13

Chung, Angeline, 0V

Clifford, Chris, 0V

Constantoudis, Vassilios, 0K

Dawson, Guy, 08

De Bisschop, Peter, 0V

Ducoté, Julien, 0L

Egodage, Kokila, 0I

Ehrlich, Christian, 0I

Ekinci, Yasin, 08

Englard, Ilan, 0U

Erben, Jens W., 0J

Farys, Vincent, 0L

Faury, T., 0Z

Fechtig, D., 0Z

Feicke, A., 0T

Fliervoet, Timon, 05

Foong, Yee Mei, 0V

Fuchsbauer, A., 0Z

Garetto, Anthony, 0I

Giollo, Manuel, 0O

Gkorou, Dimitra, 0O

Haslinger, M. J., 0Z

Helke, Christian, 0J

Hiller, Karla, 0J

Hoekstra, R., 13

Hooker, Kevin, 04

Ikeda, M., 0Z

Jähne, S., 0T

Kaiser, M., 0T

Kamikubo, Takashi, xvii

Kastner, J., 0Z

Kazarian, Aram, 04

Kazazis, Dimitrios, 08

Kirchner, R., 13

Kleinjans, Herberth, 0J

Koepplmayr, T., 0Z

Koster, Norbert, 03

Kristlib, M., 0T

Kuechler, Bernd, 04

Kulse, P., 0P

Kurth, Steffen, 0J

Kurzmann, J., 0Z

Lakcher, Amine, 0L

Lam, Auguste, 0O

Laubis, Christian, 09

Le-Gratiet, Bertrand, 0L

Lemme, Max C., 0G

Liu, Xing Lan, 0O

Lorbeer, J., 0T

Lucas, Kevin, 04

Luong, Kim Vu, 09

Lutich, Andrey, 0M, 10

Malik, Nitin Singh, 0U

Matsumoto, Hiroshi, 07

McClelland, Alexandra, 08

McNamara, John, 05

Meinig, Marco, 0J

Miheev, Peter A., 0X

Miura, Satoru, xvii

Mohtashami, Abbas, 0U

Muehlberger, M., 0Z

Nakayamada, Noriaki, xvii

Navarro, Violeta, 0U

Nesladek, P., 0T

Nishimura, Rieko, xvii

Nomura, Haruyuki, xvii

Nowak, Christoph, 0J

Ohtoshi, Kenji, 07

Oorschot, Dorothe, 05

Otto, Thomas, 0J

Papavieros, George, 0K

Philipsen, Vicky, 09

Popescu, Carmen, 08

Porschatis, Caroline, 0G

Rakhovskii, Vadim I., 0X

Reuter, Danny, 0J

Robinson, Alex P. G., 08

Roth, John, 08

Sadeghian, Hamed, 0U

Sasai, K., 0P

Savari, Serap A., 0C

Schatz, Jirka, 0M, 10

Schift, H., 13

Schneider, Loïc, 0L

Scholze, Frank, 09

Schulz, K., 0P

Schulz, Kristian, 0I

Shamaev, Alexei S., 0X

Shemesh, Dror, 0U

Staring, Wilbert, 03

Sturtevant, John, 0V

Tabbone, Gilles, 0I

Tamura, Takao, 07

te Sligte, Edwin, 03

Thaler, Thomas, 0V

Theis, Wolfgang, 08

Ünal, Nezih, 0G

Utzny, Clemens, 0N

van de Kerkhof, Mark, 05

van Haren, Richard, 0O

Verberk, Rogier, 03

Wahlbrink, Thorsten, 0G

Wandel, T., 0T

Wang, Ziyang, 05

Weisbuch, François, 0M, 10

Wietstruck, M., 0P

Wittebrood, Friso, 05

Woegerer, C., 0Z

Xiao, Guangming, 04

Yamashita, Hiroshi, 07

Yoshida, Koichiro, 0D

Conference Committee

Conference Chairs

  • Uwe F.W. Behringer, UBC Microelectronics (Germany)

  • Jo Finders, ASML Netherlands B.V. (Netherlands)

Conference Co-Chairs

  • Brid Connolly, Toppan Photomasks, Inc. (Germany)

  • Chris Gale, Applied Materials GmbH (Germany)

  • Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

Program Chairs

  • Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

  • Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementechnologie IISB (Germany)

  • José Pozo, European Photonics Industry Consortium (Belgium)

Program Co-Chairs

  • Rolf Seltmann, GLOBALFOUNDRIES Dresden (Germany)

  • Daniel Sarlette, Infineon Technologies Dresden (Germany)

Other Members

  • Carola Bläsing, Carl Zeiss SMS GmbH (Germany)

  • Parkson Chen, Taiwan Mask Corporation (Taiwan)

  • Albrecht Ehrmann, Carl Zeiss SMT GmbH (Germany)

  • Dave Farrar, HOYA Corporation (United Kingdom)

  • Rik Jonckheere, IMEC vzw (Belgium)

  • Barbara Lauche, Photronics MZD GmbH (Germany)

  • Carlos Lee, European Photonics Industry Consortium (Belgium)

  • Bertrand Le-Gratiet, STMicroelectronics (France)

  • Harry Levinson, GLOBALFOUNDRIES (United States)

  • Hans Löschner, IMS Nanofabrication AG (Austria)

  • Michael Muehlberger, Profactor GmbH (Austria)

  • Jan Hendrik Peters, BMBG-Consult (Germany)

  • Chris Progler, Photronics Inc. (United States)

  • Douglas J. Resnick, CNT-Canon (United States)

  • Klaus-Dieter Röth, KLA-Tencor MIE (Germany)

  • Thomas Scherübl, Carl Zeiss SMT GmbH (Germany)

  • Ronald Schnabel, VDE/VDI-GMM (Germany)

  • Steffen Schulze, Mentor Graphics Corporation (United States)

  • Yoshitake Shusuke, NuFlare (Japan)

  • Martin Tschinkl, AMTC (Germany)

  • Jacques Waelpoel, ASML Netherlands B.V. (Netherlands)

  • James N. Wiley, ASML US, Inc. (United States)

  • C. Grant Willson, University of Texas, Austin (United States)

  • Hermann Wolf, Photronics MZD GmbH (Germany)

  • Stefan Wurm, Atice LLC (United States)

  • Larry Zurbrick, Keysight (United States)

Session Chairs

  • Plenary Session I

  • Uwe F.W. Behringer, UBC Microelectronics (Germany)

  • Hans Löschner, IMS Nanofabrication AG (Austria)

  • Plenary Session II

  • Jo Finders, ASML Netherlands B.V. (Netherlands)

  • James N. Wiley, ASML US, Inc. (United States)

  • Wafer Lithography (193i and EUV)

  • Jo Finders, ASML Netherlands B.V. (Netherlands)

  • Rolf Seltmann, GLOBALFOUNDRIES Dresden (Germany)

  • Mask Patterning, Metrology, and Process

  • Martin Tschinkl, AMTC (Germany)

  • Jan Hendrik Peters, BMBG-Consult (Germany)

  • Plenary Session III

  • Uwe F.W. Behringer, UBC Microelectronics (Germany)

  • Serap Savari, Texas A&M University (United States)

  • Non-IC Applications

  • Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementechnologie IISB (Germany)

  • Vassilios Constantoudis, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece), and Aristotle University of Thessaloniki (Greece)

  • Nano-Imprint Lithography

  • Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

  • Michael Muehlberger, Profactor GmbH (Austria)

  • Mask2Wafer Metrology

  • Jan Hendrik Peters, BMBG-Consult (Germany)

  • François Weisbuch, GLOBALFOUNDRIES Dresden (Germany)

  • Using the Data/Big Data

  • Bertrand Le-Gratiet, STMicroelectronics (France)

  • Izak Kapilevich, Applied Materials Inc. (United States)


On behalf of VDE/VDI-GMM, the EMLC2017 sponsors, and the EMLC2017 organizing and international program committees, we welcome you to the proceedings from the 33rd European Mask and Lithography Conference, EMLC2017, at the Hilton Hotel in Dresden, Germany.

The conference has annually brought together scientists, researchers, engineers, and technologists from research institutes and companies from around the world to present innovations at the forefront of mask lithography and mask technology. The two and a half day conference is dedicated to the science, technology, engineering, and application of mask and lithography technologies and associated processes, giving an overview of the present status in mask and lithography technologies and the future strategy where mask producers and users have the opportunity of becoming acquainted with new developments and results. This year’s sessions included: Wafer Lithography (193i and EUV), Mask Patterning, Metrology, and Process, Non-IC Applications, Nano-Imprint Lithography, Mask2Wafer Metrology, and Using the Data / Big Data.

Mathias Kamolz from Infineon Technologies (Germany) was the welcome speaker. He presented, “The Power of Power-Semiconductors.”

Jim Wiley from ASML US, Inc. (United States) was the first keynote speaker. His talk was titled “The Status and Challenges of the EUV photomask ecosystem.”

The second keynote speaker was Bryan Rice from Globalfoundries Dresden (Germany) who presented “Breaking the Paradigm: FDX Technology at Globalfoundries.”

The third keynote speaker was Paul Ackmann from Globalfoundries Inc. (United States). The title of his presentation was “Integral Nature of Masks through five Decades.”

We invited Kurt Ronse from IMEC (Belgium) who presented a talk titled “Recent EUV developments at IMEC.”

As every year, the Best Paper and Best Poster from BACUS 2016 were presented, followed by the Best Paper from PMJ 2017. A total of 47 papers—3 keynotes, 9 invited, 20 orals and 15 posters—were presented.


For the first time, the conference included two tutorials. Andreas Erdmann from Fraunhofer IISB (Germany) gave the first tutorial on “General introduction into lithographic imaging by projection optics.” The second tutorial, “Interaction of mask and scanner in EUV projection optics,” was presented by Jo Finders from ASML Netherlands B.V.

Technical Exhibition

Parallel to the conference presentations, a technical exhibition took place on Tuesday and Wednesday where companies (mask suppliers, material suppliers, and equipment suppliers) exhibited their companies and products. To foster the exchange between the conference attendees and the exhibitors, the exhibition area was also the place for all coffee and lunch breaks.

We hope that you enjoyed the technical sessions of the EMLC2017 as well as the technical exhibition, but also allowed yourself to visit the beautiful city of Dresden.

Uwe F.W. Behringer

EMLC2017 Conference Chair

Sponsors and Cooperating Partners

The 33rd European Mask and Lithography Conference, EMLC 2017, would like to express its sincere appreciation to all the sponsors and coopering partners mentioned below for their support

© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 10446", Proc. SPIE 10446, 33rd European Mask and Lithography Conference, 1044601 (10 October 2017); doi: 10.1117/12.2302899; https://doi.org/10.1117/12.2302899

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