Impact of slurry pH on material removal rate and surface quality of polished fused silica

Melanie Redien; Cedric Maunier; Bertrand Remy; Karine Poliakoff-Leriche; Jerome Neauport

doi:10.1117/12.2279798

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16 October 2017 Impact of slurry pH on material removal rate and surface quality of polished fused silica

Melanie Redien, Cedric Maunier, Bertrand Remy, Karine Poliakoff-Leriche, Jerome Neauport

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Proceedings Volume 10448, Optifab 2017; 104480F (2017) https://doi.org/10.1117/12.2279798
Event: SPIE Optifab, 2017, Rochester, New York, United States

Abstract

We have selected and characterized 2 cerium oxide slurries. We have then modified their pH to polish fused silica samples. The material removal rate, roughness, surface defects density and morphology have been observed as a function of pH. We noticed that while roughness and surface defect density don’t seem to be very affected by slurry pH, the latter has an influence on material removal rate and width of the scratches generated during polishing.

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Melanie Redien, Cedric Maunier, Bertrand Remy, Karine Poliakoff-Leriche, and Jerome Neauport "Impact of slurry pH on material removal rate and surface quality of polished fused silica", Proc. SPIE 10448, Optifab 2017, 104480F (16 October 2017); https://doi.org/10.1117/12.2279798

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