Paper
13 June 2017 Out of the lab and into the fab: Nano-alignment as an enabler for Silicon Photonics’ next chapter
Scott Jordan
Author Affiliations +
Proceedings Volume 10449, Fifth International Conference on Optical and Photonics Engineering; 104490Z (2017) https://doi.org/10.1117/12.2270400
Event: Fifth International Conference on Optical and Photonics Engineering, 2017, Singapore, Singapore
Abstract
The rapid advent of Silicon Photonics presents many challenges for test and packaging. Here we concisely review SiP device attributes that differ significantly from classical photonic configurations, with a view to the future beyond current, connectivity-oriented silicon photonics developments, looking to such endeavors as all-optical computing and quantum computing. The necessity for nano-precision alignment of optical elements in test and packaging operations quickly emerges as the unfilled need. We review the industrial test and packaging solutions developed back in the 1997-2001 photonics boom to address the needs of that era's devices, and map their gaps with the new SiP device classes. Finally we review the new state-of-the-art of recent advances in the field that address these gaps.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott Jordan "Out of the lab and into the fab: Nano-alignment as an enabler for Silicon Photonics’ next chapter", Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104490Z (13 June 2017); https://doi.org/10.1117/12.2270400
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Packaging

Optical alignment

Silicon photonics

Photonics

Manufacturing

Optical fibers

Optics manufacturing

Back to Top