13 July 2017 Shin-Etsu super-high-flat substrate for FPD panel photomask
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Abstract
Recently, high-resolution exposure machine has been developed for production of high-definition (HD) panels, and higher-flat photomask substrates for FPD is being expected for panel makers to produce HD panels. In this presentation, we introduce about Shin-Etsu’s advanced technique of producing super-high-flat photomask substrates. Shin-Etsu has developed surface polishing and planarization technology with No.1-quality-IC photomask substrates. Our most advanced IC photomask substrates have gained the highest estimation and appreciation from our customers because of their surface quality (non-defect surface without sub-0.1um size defects) and ultimate flatness (sub-0.1um order having achieved). By scaling up those IC photomask substrate technologies and developing unique large-size processing technologies, we have achieved creating high-flat large substrates, even G10-photomask size as well as regular G6-G8 photomask size. The core technology is that the surface shape of the substrate is completely controlled by the unique method. For example, we can regularly produce a substrate with its flatness of triple 5ums; front side flatness, back side flatness and total thickness variation are all less than 5μm. Furthermore, we are able to supply a substrate with its flatness of triple 3ums for G6-photomask size advanced grade, believed to be needed in near future.
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Youkou Ishitsuka, Youkou Ishitsuka, Daijitsu Harada, Daijitsu Harada, Atsushi Watabe, Atsushi Watabe, Masaki Takeuchi, Masaki Takeuchi, } "Shin-Etsu super-high-flat substrate for FPD panel photomask", Proc. SPIE 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology, 1045405 (13 July 2017); doi: 10.1117/12.2278704; https://doi.org/10.1117/12.2278704
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